Home » Arbitrary Modeling of Tsvs for 3D Integrated Circuits by Khaled Mohamed
Arbitrary Modeling of Tsvs for 3D Integrated Circuits Khaled Mohamed

Arbitrary Modeling of Tsvs for 3D Integrated Circuits

Khaled Mohamed

Published September 5th 2014
ISBN : 9783319076102
Hardcover
179 pages
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 About the Book 

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearbyMoreThis book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.